Soldering and Materials TechnologyLaajuus (3 ECTS)

Objective

Students know typical packages used for electronic components and typical soldering methods in electronics industry, understand the function of flux, heat and solder in soldering process.

Students can analyse qualitatively binary solid-liquid phase diagrams.

Content

Different types of packages, metallurgy of soldering, phase diagrams, principles of soldering process. Some materials used in electronics.

Effect of impurities to the soldering, intermetallic layer and its thickness, different types of fluxes.

Further information

Class room teaching: 28 h
Laboratory exercises:
Project: 15 h
Exam: 3 h
Student individual workload: 35 h
Total: 81 h